MIL-C-14550, AMS 2418 and ASTM B734
Copper plating process has been used typically to provide an anti-seize surface, to prevent carburizing of surfaces on which carburizing is neither required or permitted, to prevent decarburization, to enhance solderability, or to provide a source of copper for furnace brazing.
Copper plating is also used as undercoat for subsequent plating to increase brightness and ductility.
CLASSES
Class 0 – 25.4µm to 127 µm
Class 1 – Minimum 25.4 µm
Class 2 – Minimum 12.7 µm
Class 3 – Minimum 5.08 µm
Class 4 – Minimum 2.54µm